Hot Melt Adhesive
It is made by high temperature reaction of dimeric acid and polyamine.Soluble in general organic solvents, its heating melting viscosity and heating temperature has a great relationship. It has the characteristics of low viscosity, good flow performance, good toughness and high bond strength.
Performance Characteristics
1.It has good low temperature solubility and soluble fusibility
2.It has high thermal stability.
3.It has strong flexibility.
Specification of Product
Product Name : Hot Melt Adhesive

CAS No.: 25587-80-8
Molecular formula: (C11H23NO2)x
Hot Melt Adhesive Specification
Type CXD-01 CXD-02
Color(Fe-Co) ≤7# ≤7#
Viscosity,mpa.s/25℃ 150-250 250-350
Acid value,mgkoH/g ≤6 ≤6
Amine value(mgKOH/g) ≤5 ≤5
Softening point(Global Law)℃ 110±5 120±5

Hot Melt Adhesive resin Packing
Two-in-one paper-plastic packaging bag, 25KG/ bag.
Hot Melt Adhesive Storage
This product should be stored and transported as a non-hazardous material. Store it in a cool, ventilated place. Do not store it with acids, alkalis, or corrosive substances. Ensure it is protected from moisture, heat, fire, and corrosion.
Shelf life: With proper packing and storage,guarantee period is 1 years.
Hot Melt Adhesive Application
1.Hot melt adhesive for electronic and electrical shrinkable materials.
2.shoe material, clothing, leather and other hot glue.
3.hot melt adhesive, etc